Home Clamshell BGA Socket features heat sink lid.
 

Keywords :   


Clamshell BGA Socket features heat sink lid.

2015-02-27 14:30:55| Industrial Newsroom - All News for Today

Designed for 25 x 25 mm package size, Model GT-BGA-2019 operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. Socket is designed to dissipate 7 W using compression screw with heat sink fins and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Constructed with low inductance elastomer contactor, socket features typical contact resistance of 30 mΩ per pin and is mounted on target PCB with no soldering.

Tags: features heat lid socket

Category:Industrial Goods and Services

Latest from this category

All news

19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
27.113Q3
27.113DS 52
27.11
27.11Xotic Effects BB+ Plus
27.11
27.11 J. Lindeberg SS /
27.11
27.11DX
More »