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Clamshell Spring Pin BGA Socket accommodates 36-ball FCCSP.

2014-03-18 13:31:07| Industrial Newsroom - All News for Today

Operating from -55 to +180°C, CBT-BGA-7501 is configured to test 2.4 x 2.4 mm BGA package with 0.4 mm pitch, 36-position, 6 x 6 ball array configuration. Spring pin contactor, stamped with 14.3 g actuation force per ball, has cycle life of 125,000 insertions, self inductance of 0.98 nH, and insertion loss < 1 dB at 31.7 GHz. Current capacity of each contactor is 1.8 A @ 30°C temperature rise. Using supplied hardware on target PCB, socket mounts without any soldering. This story is related to the following:Ball Grid Array (BGA) Sockets |

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