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Cloud Exhibits Water Soluble Packaging Technology at interpack
2014-04-17 06:00:00| Industrial Newsroom - All News for Today
Cloud introduces its bag packaging equipment and the Hydroforma SP to interpack.<br /> <br /> Des Plaines, IL, USA — For its first visit to interpack, Cloud Packaging Solutions will display its Hydroforma SP water-soluble pouch packaging machine in Stand C14, Hall 14 in Düsseldorf, May 8 – 14, 2014. It will also display one of its high speed continuous motion pouch packaging machines. Personnel from sales, engineering, operations and marketing will be on hand to answer attendee's ...This story is related to the following:Machinery and Machining Tools Sponsored by: AMT (IMTS) - Category Sponsor April2014Search for suppliers of: Fill & Seal Form Machinery |
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