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Computer-on-Modules target rugged, fanless systems.

2013-12-09 14:28:55| Industrial Newsroom - All News for Today

Featuring 95 x 95 mm form factor for fanless and fully enclosed system designs, COMe-cHL6 COM Express® compact Computer-on-Modules are equipped with ultra-low TDP versions of 4th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® processors. With Intel® AVX2 and OpenCL 1.2, modules boost floating point performance as well as parallel processing density. Units feature up to 16 GB DDR3L RAM, 3 independent display outputs, 4x SATA 6 Gbps ports, Gigabit Ethernet, 2x USB 3.0, and 8x USB 2.0. This story is related to the following:Single Board Computers | Computer Boards |

Tags: systems target rugged fanless

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