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Conductive Adhesive has low-temperature cure capability.

2016-02-11 14:31:05| Industrial Newsroom - All News for Today

Designed for circuit assembly applications, EMS 618-116 cures in 30 min at 100°C or faster at elevated temperatures and forms high-strength, high-reliability conductive interconnects. This conductive adhesive, as low-temperature cure, single-part system, specifically suits static drain and EMI/RFI shielding applications.

Tags: capability cure adhesive conductive

Category:Industrial Goods and Services

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