Intended for back contact applications in crystalline silicon solar modules, DB-1588-3 is stress absorbing to withstand thermal cycling effects and features conductive stability to back contact metallizations during damp heat exposure. Adhesive specifically makes contact from vias or other conductors on solar cells to back contact sheet and is designed to cure through encapsulant lamination and cure process.
This story is related to the following:Electrically Conductive Adhesives |