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Conductive Adhesive suits die attach applications.
2014-01-10 14:30:44| Industrial Newsroom - All News for Today
Designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics, or camera modules, CA-175 Snap Cure Conductive Adhesive has moderate glass transition temperature (Tg) and modulus. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement. Able to achieve full cure in 8 sec at 200°C, adhesive is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. This story is related to the following:Electrically Conductive Adhesives
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Category:Industrial Goods and Services