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Continuous Innovation in Packaging and Manufacturing Processes: How to Ensure Best Quality and ...

2013-05-01 06:00:00| Industrial Newsroom - All News for Today

Multitest offers innovative approaches for test strategies of 3D ICs and Sensors &ndash; Meet Multitest at ECTC, May 28-30, Las Vegas<br /> <br /> Rosenheim, Germany &ndash; Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, will exhibit at the upcoming ECTC, scheduled to take place May 28-30, 2013 at The Cosmopolitan in Las Vegas, NV.<br /> <br /> Experts for 3D ...This story is related to the following:Electronic Components and DevicesSensors | Microelectromechanical Systems (MEMS) Test Equipment | Integrated Circuits (IC) |

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