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Copper Paste System targets power electronic applications.

2014-02-18 14:33:37| Industrial Newsroom - All News for Today

Optimized for greater than 50 micron fired film thickness with one process cycle, Thick Print Copper Paste System can be used to create copper circuits from 20–350 microns thick on alumina and aluminum nitride substrates. As alternative to direct bonded copper products, thick print copper is electroless nickel, immersion gold plateable for soldering and wire-bonding assembly. RoHS-compliant system has proven superior thermal cycling performance over DBC by passing 1,000 cycles without failure. This story is related to the following:Copper Paste

Tags: system power applications electronic

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