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Defect Inspection System handles wafers up to 300 mm.

2013-09-10 14:31:32| Industrial Newsroom - All News for Today

Designed for semiconductor, MEMS, and LED facilities, NSX® 220 Automated Macro Defect Inspection System uses gray-scale image analysis with color image capture for inspection and metrology in final manufacturing applications. It can detect scratches, mechanical damage, foreign materials, voids, and probe damage, while also performing 2D measurements on bumps, probe marks, and edge trim processes. System operates over 10–0.5 µm resolutions with brightfield and optional darkfield illumination. This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Inspection Systems | Surface Defect Detection Systems | Semiconductor Inspection Equipment

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