Designed for semiconductor, MEMS, and LED facilities, NSX® 220 Automated Macro Defect Inspection System uses gray-scale image analysis with color image capture for inspection and metrology in final manufacturing applications. It can detect scratches, mechanical damage, foreign materials, voids, and probe damage, while also performing 2D measurements on bumps, probe marks, and edge trim processes. System operates over 10–0.5 µm resolutions with brightfield and optional darkfield illumination.
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