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Die-Attach Adhesives offer optimized rheology.

2015-01-26 14:31:26| Industrial Newsroom - All News for Today

Intended for microelectronics and semiconductor industries, Electraset™ electrically conductive die attach adhesives conform to Test Method 5011 in MIL-STD-883. Electraset™ 620 couples low cure shrinkage with low coefficient of thermal expansion, minimizing chip or device warping and preventing cracking or delamination. Electraset™ 620-2 has virtually no bleed and minimal spreading, tailing, or stringing. Electraset™ 620-3 is used for dispensing, stenciling, and doctor blade application.

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Category:Industrial Goods and Services

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