Utilizing energized plasma, MicroDieSingulator (MDS)-100 systems deliver singulation of semiconductor dies from 4, 6, and 8 in. wafers mounted on industry-standard tape frames. Singulation (dicing) of individual dies can be achieved with separation lines (streets) of 20 microns or less, maximizing utilization of silicon-wafer real-estate. Also, MDS technology separates dies without causing lateral damage from stress-induced cracking, overheating, or re-deposition of ablated material.
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