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Dow Corning Joins EV Group's Open Platform for Temporary Bonding Materials for 3D-IC ...

2013-09-03 06:00:00| Industrial Newsroom - All News for Today

Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging<br /> <br /> ST. FLORIAN, Austria -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp&trade; platform for room-temperature wafer bonding and debonding processes. The ...This story is related to the following:Cyanoacrylate Debonders |

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