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Dow Corning Takes Prestigious 3D InCites Award for Its Advanced New Temporary Bonding Solution ...

2013-07-17 06:00:00| Industrial Newsroom - All News for Today

MIDLAND, Mich. &ndash; Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced that it has won a prestigious 3D InCites Award for its innovative new Temporary Bonding Solution for 2.5D and 3D IC packaging applications. Winning the Materials category, Dow Corning accepted the award at a well-attended, invitation-only ceremony held during last week's SEMICON West 2013 in San Francisco.<br /> <br /> 3D InCites, an online media resource promoting news, ...This story is related to the following:Bonding Agents |

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