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Dry Film Negative Photoresist is designed for MEMS.

2013-04-16 18:42:10| Industrial Newsroom - All News for Today

Optimized for hot roll lamination and processing on Micro-Electro-Mechanical Systems (MEMS) and IC wafers, DF-1014 comes in various thickness formats from 5–50 µm, ±5% and features glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C. Exhibiting resistance to extreme moisture conditions and corrosive chemicals, cured chemistry can withstand harsh environments. Material formulation is compatible and can be used in contact with EMS spin coatable photoresists. This story is related to the following:Photoresists

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