Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3010 Dry Film Negative Photoresist is available in thickness formats from 5–50 µm, ±5%. Film offers glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25°C. Hydrophobic in nature, product can withstand harsh environments including extreme moisture conditions and corrosive chemicals once cured. DF-3010 can be used in contact with EMS line of spin coatable photoresists.