Home › Dry Film Negative Photoresist suits MEMS/CMOS applications.
 

Keywords :   


Dry Film Negative Photoresist suits MEMS/CMOS applications.

2016-02-01 14:31:06| Industrial Newsroom - All News for Today

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3010 Dry Film Negative Photoresist is available in thickness formats from 5–50 µm, ±5%. Film offers glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25°C. Hydrophobic in nature, product can withstand harsh environments including extreme moisture conditions and corrosive chemicals once cured. DF-3010 can be used in contact with EMS line of spin coatable photoresists.

Tags: film applications negative dry

Category:Industrial Goods and Services

Latest from this category

All news
15.09Your MANA RepFinder Profile
13.09A League of Their Own Womens Special Interest Group Invites You to Attend a MANAchat on September 26
Industrial Goods and Services »
22.09Eastern North Pacific Tropical Weather Outlook
22.09Atlantic Tropical Weather Outlook
21.09Atlantic Tropical Weather Outlook
21.09Eastern North Pacific Tropical Weather Outlook
21.09Strategies to minimize fallback pigs in the nursery
21.09This Week in Agribusiness, Sept. 21, 2024
21.09This Week in Agribusiness, Sept. 21, 2024
21.09RABapp provides rapid response insight in animal health emergencies
More »