Home Dry-Film Negative Photoresist suits MEMS, wafer applications.
 

Keywords :   


Dry-Film Negative Photoresist suits MEMS, wafer applications.

2015-01-09 14:30:56| Industrial Newsroom - All News for Today

Optimized for hot roll lamination and processing on micro electro mechanical systems (MEMS) and IC wafers, DF-3020 comes in thickness formats from 5–50 µm, ±5%. Cured chemistry can withstand harsh environments, including extreme moisture and corrosive chemicals; glass transition temperature is 158°C; and moderate modulus is 3.5 GPa at 25°C. Suited for MEMS and wafer-level packaging applications (TSV sealing), hydrophobic product can be used in contact with EMS spin coatable photoresists.

Tags: applications negative suits wafer

Category:Industrial Goods and Services

Latest from this category

All news

19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
27.113Q3
27.113DS 52
27.11
27.11Xotic Effects BB+ Plus
27.11
27.11 J. Lindeberg SS /
27.11
27.11DX
More »