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Dry Film Negative Photoresist targets MEMS applications.

2013-11-06 14:29:39| Industrial Newsroom - All News for Today

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3020 Antimony-free Photoresist is available for sampling in 20 µm thickness, ±1 µm and can be manufactured from 5–25 µm thick. Film features glass transition temperature of 165°C and moderate modulus of 4 GPa at 25°C. Hydrophobic in nature, cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals. This story is related to the following:Photoresists

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Category:Industrial Goods and Services

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