Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3020 Antimony-free Photoresist is available for sampling in 20 µm thickness, ±1 µm and can be manufactured from 5–25 µm thick. Film features glass transition temperature of 165°C and moderate modulus of 4 GPa at 25°C. Hydrophobic in nature, cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals.
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