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EDA Software cuts die-package interconnect planning time.

2014-05-30 14:31:06| Industrial Newsroom - All News for Today

Used early in design cycle, Cadence® OrbitIO™ provides rapid planning of interfaces across multiple fabrics. As part of overall co-design solution, Cadence OrbitIO integrates with Cadence SiP Layout and Cadence Encounter® digital implementation platform, allowing design teams to clearly communicate design intent throughout flow. Software can enable fabless semiconductor or systems companies to evaluate package route feasibility, and communicate route plan to package design resources. This story is related to the following:Electronic Design Automation (EDA) Software

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