Home › ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System
 

Keywords :   


ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System

2016-03-25 11:31:10| Industrial Newsroom - All News for Today

ESIs CornerStone ICP platform will facilitate the centers ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for...

Tags: system center research addition

Category:Industrial Goods and Services

Latest from this category

All news
01.07Mentorship in Motion
Industrial Goods and Services »
04.07Atlantic Tropical Weather Outlook
04.07Eastern North Pacific Tropical Weather Outlook
04.07Hurricane Beryl Graphics
04.07Hurricane Beryl Public Advisory Number 22A
04.07Summary for Hurricane Beryl (AT2/AL022024)
04.07Japan declares victory in 'war' on floppy disks
04.07'Airport parking firms left us out of pocket'
04.07Jeff Bezos to sell another $5bn of Amazon shares
More »