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› ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System
ESI Joins Georgia Tech 3D Systems Packaging Research Center with Addition of its Latest IC Packaging System
2016-03-25 11:31:10| Industrial Newsroom - All News for Today
ESIs CornerStone ICP platform will facilitate the centers ongoing 3D packaging and system scaling research, focusing on accelerating global co-development with end users and supply chains. PORTLAND, Ore. - Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator of laser-based manufacturing solutions for...
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