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ESSEMTEC to Highlight a Range of Leading-Edge Technologies at SMT Hybrid Packaging 2013

2013-04-10 06:00:00| Industrial Newsroom - All News for Today

Essemtec, a leading manufacturer of surface mount technology (SMT) production equipment, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.<br /> <br /> For years, Essemtec&rsquo;s FLX was the world&rsquo;s most popular pick-and-place machine for flexible SMD production. Many specific customer applications were ...This story is related to the following:Computer Hardware and PeripheralsMaterial Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesSurface Mount Technology Placement Systems | Stencil Printers | Automatic Feeders |

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