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EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced ...
2014-01-14 06:00:00| Industrial Newsroom - All News for Today
EVG® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices<br /> <br /> ST. FLORIAN, Austria – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG® 850TB/DB fully automated bonding/debonding equipment ...This story is related to the following:Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category SponsorWafer Processing Systems | Bonding Machinery | Wafer Coating Equipment
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