Carteret, NJ — SARCON® SPG-30A from Fujipoly is an ideal thermal interface option for circuit boards with a large surface area, many components and delicate solder points. The form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader. The material's high viscosity and ultra-low compression force are ideal for applications with gaps ranging from .30mm to 1.0mm. <br />
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Once applied, SARCON® SPG-30A delivers a ...This story is related to the following:Thermal Compounds