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Electrical Characterization Of Packages For Use With GaAs MMIC Amplifiers

2015-10-14 17:55:03| rfglobalnet Home Page

Most packaging vendors have little or no microwave design and characterization capabilities added to their products, so a specific fixturing technique was developed and made applicable to nearly any style device. This test methodology combines the advantages of on-wafer RF probing with a TRL calibration to create a completely de-embeddable, novel “test fixture.” This technique is used to characterize microwave packages in order to identify the appropriate packages for amplifier products covering frequencies up to 12 GHz, to characterize injection-molded plastic packages, and to evaluate nn-probeable MMIC’s.

Tags: packages electrical characterization amplifiers

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