Designed for lift-off compound semiconductor applications, Temescal UEFC-4900 offers benefits of Auratus™ Deposition Process Enhancement Methodology, producing near-perfect uniformity while cutting material consumption. Conical shaped vacuum chamber maximizes wafer capacity, while High-Uniformity Lift-off Assembly design uses dual-axis motion to optimize collection efficiency. With pumping capacity of 39,000 L/sec, UEFC-4900 can process up to 25 150 mm wafers/batch.
This story is related to the following:Machinery and Machining Tools Sponsored by: AMT (IMTS) - Category Sponsor April2014Wafer Processing Systems | Electron Beam (EB) Machinery | Electron Beam Physical Vapor Deposition (EBPVD) Coating Equipment |