To optimize Through Silicon Via (TSV) and Through Wafer Via (TWV) processes, Solstice® electroplating systems provide plating for MEMS, sensors, RF, interposers, and other technologies for ≤200 mm wafers. Flexibly configurable solution combines chambers for critical blind via pre-wet operation with copper plating on automation frame. Solstice can routinely produce fully filled or lined vias with widths ranging from 5–250 micron having aspect ratios as high as 9:1.