Available for ≤200 mm Solstice® Electroplating Systems, Plating-Plus™ capability allows additional processes to be integrated into single plating tool. High-Pressure Metal Lift-Off chamber enables high-efficiency metal removal without redeposition, while Resist Strip chamber handles solvents safely and can run single stripping process across different resists. UBM Etch Chamber incorporates intelligent optical end-point detection technology that controls etching to avoid undercut.