je.st
news
Electroplating Systems utilize 3 modular processing chambers.
2016-03-28 14:31:07| Industrial Newsroom - All News for Today
Available for ≤200 mm Solstice® Electroplating Systems, Plating-Plus™ capability allows additional processes to be integrated into single plating tool. High-Pressure Metal Lift-Off chamber enables high-efficiency metal removal without redeposition, while Resist Strip chamber handles solvents safely and can run single stripping process across different resists. UBM Etch Chamber incorporates intelligent optical end-point detection technology that controls etching to avoid undercut.
Tags: systems
processing
utilize
chambers
Category:Industrial Goods and Services