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Epoxy Potting Compound resists thermal shock and cycling.

2016-01-19 14:31:06| Industrial Newsroom - All News for Today

Passing Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize performance properties. Applications include electronic potting and encapsulating, casting, coating, and electrical varnishes.

Tags: shock thermal compound cycling

Category:Industrial Goods and Services

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