Suited for optical packaging applications where several temperature-sensitive materials are bound together, DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping. This multi-purpose, one-component adhesive can be processed within 48 hr at room temperature and adheres to various plastics as well as metals and FR4 composites. Dispensed through needles with diameter as small as 200 µm, product exhibits low thermal stress and moderate shrinkage during curing.
This story is related to the following:Chemical Processing and Waste ManagementThermal Cure Adhesives | Optical Adhesives |