Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder in Booth #4626 at the upcoming SPIE Photonics West exhibition, scheduled for February 5-7, 2013 at the Moscone Center in San Francisco, CA.
The semi-automated configuration of the FINEPLACER® Lambda, which will be exhibited at the show, provides automated die placement and controlled bonding after manual alignment of die and substrate. Advantages of this system include hands-off die placement, process ...This story is related to the following:Ultrasonic Bonders |