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Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

2013-01-01 06:00:00| Industrial Newsroom - All News for Today

Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder in Booth #4626 at the upcoming SPIE Photonics West exhibition, scheduled for February 5-7, 2013 at the Moscone Center in San Francisco, CA. The semi-automated configuration of the FINEPLACER® Lambda, which will be exhibited at the show, provides automated die placement and controlled bonding after manual alignment of die and substrate. Advantages of this system include hands-off die placement, process ...This story is related to the following:Ultrasonic Bonders |

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