je.st
news
Home
› Freescale RF Industrial Portfolio Expands with Introduction of Rugged Plastic Packaged Power Amplifiers
Freescale RF Industrial Portfolio Expands with Introduction of Rugged Plastic Packaged Power Amplifiers
2014-06-03 07:00:00| Freescale Press Releases
Legacy of plastic packaging innovation for wireless infrastructure equipment continues with an industry first for harsh industrial environments TAMPA BAY, Fla.--(BUSINESS WIRE)--Jun. 3, 2014-- Continuing its long track record of RF power technology leadership, Freescale Semiconductor (NYSE: FSL) introduces its first plastic packaged devices designed specifically for high ruggedness applications. The new MRFE6VP5150N/GN and MRFE6VP5300N/GN power amplifiers are the industrys first > 65:1 VSWR rated devices to be housed in over molded plastic packaging. For more information click on title.
Tags: power
industrial
introduction
plastic
Category:Electronics and Electrical
Latest from this category |
All news |
||||||||||||||||||||
|
|
||||||||||||||||||||