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Freescale RF Industrial Portfolio Expands with Introduction of Rugged Plastic Packaged Power Amplifiers

2014-06-03 07:00:00| Freescale Press Releases

Legacy of plastic packaging innovation for wireless infrastructure equipment continues with an industry first for harsh industrial environments TAMPA BAY, Fla.--(BUSINESS WIRE)--Jun. 3, 2014-- Continuing its long track record of RF power technology leadership, Freescale Semiconductor (NYSE: FSL) introduces its first plastic packaged devices designed specifically for high ruggedness applications. The new MRFE6VP5150N/GN and MRFE6VP5300N/GN power amplifiers are the industrys first > 65:1 VSWR rated devices to be housed in over molded plastic packaging. For more information click on title.

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Category:Electronics and Electrical

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