Exhibiting less than 10 Å surface roughness with surface quality of 40-20, TECHSPEC® Fused Silica Wafers are thin, circular pieces of UV fused silica designed to be used as test substrates to measure quality of optical coatings. Each is ultrasonically cleaned and delivered in contaminant-free packaging. Available in 100, 200, and 300 mm diameters, RoHS-compliant wafers have thickness of 1.00 mm and transmission range of 0.2–2.2 µm.
This story is related to the following:Silicon Wafers