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Home › GLOBALFOUNDRIES Demonstrates Collaborative Model for Next-Generation Chip Packaging Technologies

 

GLOBALFOUNDRIES Demonstrates Collaborative Model for Next-Generation Chip Packaging Technologies

2013-11-22 14:18:12| Semiconductors - Topix.net

MILPITAS, Calif., Nov 21, 2013   -- GLOBALFOUNDRIES today unveiled details of a project that demonstrates the value of its open and collaborative approach to delivering next-generation chip packaging technologies.

Tags: model technologies packaging chip

Category:Electronics and Electrical

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