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Heat Sinks with Low Thermal Resistance
2013-02-13 12:20:28| rfglobalnet Products
Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.
Tags: low
heat
resistance
thermal
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