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High-Temperature Compound encapsulates electrical components.

2013-07-31 14:33:12| Industrial Newsroom - All News for Today

Ceramacast™ 576N large-grain, alumina-filled, ceramic compound exhibits temperature resistance to 3000°F, dielectric strength of 150 V/mil, and compressive strength of 10,200 psi. Resistant to moisture and chemicals, compound is supplied in powder form and mixed in ratio of 100 parts powder to 12–14 parts water by weight. It sets in 16 hr at room temperature or 1–2 hr at 200°F, and cured material exhibits porosity of less than 2% and shrink rate of less than 0.3% at 1000°F. This story is related to the following:Materials and Material ProcessingSearch for suppliers of: Encapsulation Compounds

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