Comprised of 17 high-density I/O modules with DIN-rail or panel-mount form factors, rugged E3 I/O™ module platform is configurable using Crimson® v3.0 and withstands demands of localized and distributed I/O applications. Products have hardened metal enclosures and offer one RS-485 terminal block and dual Ethernet ports that include user-selectable Ethernet modes for ring, pass through, and 2 network. Models offer up to 34 mixed I/O points, including I/O, analog/discrete, and temperature I/O.