Home IDT and EPC Collaborate to Integrate GaN, Silicon Into Semiconductor Devices
 

Keywords :   


IDT and EPC Collaborate to Integrate GaN, Silicon Into Semiconductor Devices

2015-06-01 13:25:33| rfglobalnet Home Page

Integrated Device Technology, Inc.(IDT) has announced its collaboration with Efficient Power Conversion (EPC) to develop technology based on Gallium nitride (GaN), a semiconductor material widely recognized for its speed and efficiency. Under their collaboration, the companies will explore integratingEPC’s eGaN technology with leadingIDTsolutions.

Tags: devices integrate silicon semiconductor

Category:Telecommunications

Latest from this category

All news

»
28.11CT 700SH L
28.11rough & swell
28.11EDWARD
28.11BELDEN 8412 10m
28.11PS5CFI-1200A01
28.1116118
28.11Ado 2024 TM
28.11S.H.Figuarts
More »