Agenda has been released for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, which will take place September 10–12, 2013 in Chandler, AZ. Designed to help PCB supply chain and chip manufacturers meet industry demands for reliability and performance, event will begin with 2 workshops. Following days will see keynote featuring Ron Huemoeller as well as several technical conference sessions with diverse topics.
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