Home › IXYS Announces The Expansion Of The Surface Mount Packages D2-Pak (TO-263) And D3-Pak (TO-268) Without Middle Terminal For Higher Creepage Distances
 

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IXYS Announces The Expansion Of The Surface Mount Packages D2-Pak (TO-263) And D3-Pak (TO-268) Without Middle Terminal For Higher Creepage Distances

2015-07-24 04:31:01| electronicsweb Home Page

IXYS Corporation, a leader in power semiconductors and IC technologies for energy efficient products used in power conversion and motor control applications, announced recently the extension of the D2-Pak (TO-263) and D3-Pak (TO-268) packages without middle terminal for higher voltage solutions that require Surface Mount Devices (SMD) with enlarged creepage distances

Tags: middle higher surface packages

Category:Electronics and Electrical

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