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Improve Thermal and Electrical Conductivity with Pure Copper

2013-01-17 09:57:11| rfglobalnet Products

CopperViaTM is a process used to fill vias with pure copper material in ceramic thin film substrates. This is done to provide a low cost and highly conductive electrical thermal path in the substrates. This process eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.

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