Home Improve Thermal and Electrical Conductivity with Pure Copper
 

Keywords :   


Improve Thermal and Electrical Conductivity with Pure Copper

2013-01-17 09:57:11| rfglobalnet Products

CopperViaTM is a process used to fill vias with pure copper material in ceramic thin film substrates. This is done to provide a low cost and highly conductive electrical thermal path in the substrates. This process eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.

Tags: improve pure electrical thermal

Category:Telecommunications

Latest from this category

All news

»
27.113Q3
27.113DS 52
27.11
27.11Xotic Effects BB+ Plus
27.11
27.11 J. Lindeberg SS /
27.11
27.11DX
More »