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Indium Corporation Expert to Present at International Conference on Soldering and Reliability

2014-05-06 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.<br /> <br /> Briggs&rsquo; presentation, Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes, discusses a statistical comparison of the transfer efficiency of different solder powder particle sizes, specifically types 3, 4, 5, and 6, and reviews observations of post-reflow results in ...

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