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Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

2016-01-11 11:31:10| Industrial Newsroom - All News for Today

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical. Gold-based solder has a high melting point, ranging from 280°C to 1064°C...

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