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Indium Corporation Features SACm(TM) High-Reliability Solder Paste at SMT Hybrid Packaging

2014-04-29 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation will feature SACm&trade; solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.<br /> <br /> SACm&trade; is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm&trade; is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, ...This story is related to the following:Solder Paste

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