Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.<br />
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SACm™ is a high-reliability, low-cost solder paste that offers drop test performance far superior to other SAC pastes without compromising on thermal cycling – all at a cost below that of typical SAC solder paste.<br />
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SACm™ meets the electronics assembly market’s demand for a solder paste that offers the combination of good drop test ...This story is related to the following:Solder Paste