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Indium Corporation Product Specialist to Present at IMAPS Device Packaging

2014-03-06 05:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Maria Durham, product specialist for semiconductor and advanced assembly materials, will present at the IMAPS Device Packaging conference on Tuesday, March 11 in Scottsdale, Arizona.<br /> <br /> Durham&rsquo;s presentation, Solderability Challenges in Emerging BGA Packages, details the sequence of processes seen in typical BGA assembly and examines the effects of each set of prior processes on the solderability of the final pad.<br /> <br /> For more information ...

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