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Indium Corporation Product Specialist to Present at Inaugural ESTC Conference

2013-05-08 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Brook Sandy-Smith, Product Specialist - PCB Assembly Materials, will present at the inaugural Electronic System Technologies Conference May 20-23 in Las Vegas, Nev.<br /> <br /> Sandy-Smith will present Proven Strategies to Minimize Voiding under QFNs and other Bottom Termination Components. Her presentation will review proven approaches for eliminating QFN voiding, including solder paste optimization, process approaches, and the addition of engineered solder ...

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