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Indium Corporation Soldering Technology Expert to Present at IMPACT 2014

2014-09-23 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan.<br /> <br /> Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys. This presentation explores the effects of BiSnAg, as a replacement for SAC solder alloys, on joint mechanical strength, drop test ...

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