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Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium

2013-10-01 06:00:00| Industrial Newsroom - All News for Today

<a href="http://www.indium.com/">Indium Corporation</a>&rsquo;s <a href="http://www.indium.com/biographies/hongwen-zhang/">Dr. HongWen Zhang</a>, Research Metallurgist, will present at the <a href="http://www.binghamton.edu/ieec/symposium2013/symposium2013.html">2013 Electronics Packaging Symposium</a> October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang&rsquo;s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach ...

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