Home › Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium
 

Keywords :   


Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium

2013-10-01 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang&rsquo;s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.<br /> <br ...

Tags: technology present electronics corporation

Category:Industrial Goods and Services

Latest from this category

All news
31.10Consolidated Financial Statements for the six-month period ended September 30, 2024
31.10Notice regarding the revision of the business results forecasts
Industrial Goods and Services »
01.11Boeing makes 38% pay rise offer in bid to end strike
01.11The house paints that promise much more than colour
01.11Eastern North Pacific Tropical Weather Outlook
01.11Atlantic Tropical Weather Outlook
01.11Technology adoption: What's on the ag tech horizon for 2025
01.11Technology adoption: What's on the ag tech horizon for 2025
01.11How Japan's youngest CEO transformed Hello Kitty
31.10Unicharm to Expand in Africa
More »