Indium Corporation’s Brook Sandy-Smith, Product Support Specialist - PCB Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Reliability Devices May 13-14 in Minneapolis, MN.<br />
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Sandy-Smith will present the following papers:<br />
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• A Low-Silver SAC Solder Alloy for High-Reliability Applications. This presentation examines the reliability of ...